Surface Mount Assembly

Chemigraphic uses some of the most advanced surface mount equipment available; while our success as a leading sub-contract PCB manufacturer allows us to continually re-invest in state-of-the-art technology.

Spread across multiple lines, our machines deliver a combined production capability in excess of 75,000 CPH. Whether high or low volume, simple or complex, we offer the speed and resilience to deliver your manufacturing requirements against the toughest deadlines.

All Chemigraphic surface mount lines utilise Juki SMT placement machines, 7 zone reflow ovens and inline AOI, while our policy of using a single equipment manufacturer across all lines gives us the flexibility to move production between multiple lines without the need for programme changes.

Key equipment features include:

  • Total cph - 75,000
  • Total laser centered heads - 25
  • Laser placement accuracy +/- 50 µm
  • Total vision centered heads - 12
  • Vision placement accuracy +/- 30 µm
  • Smallest component - 0.4mm x 0.2mm
  • Largest component - 50mm x 150mm
  • Tallest component - 25mm
  • Smallest BGA pitch - 0.25mm
  • Smallest BGA ball diameter - 0.1mm

BGA placement

Chemigraphic are specialists in BGA placement, placing over 1738 pin BGA and double sided BGAs with outstanding results. Where required, we also have the expertise and equipment to rework and re-ball BGAs.

Reflow oven profiling

We excel in creating the perfect oven profile for all SMD products, using the latest profiling technology.

Conventional assembly >>